• FEI Helios

  • Cameca LEAP 4000 HR

  • Hysitron triboindenter

  • JEOL 3100R05


The Michigan Center for Materials Characterization, also known as (MC)2, is the University of Michigan’s facility dedicated to the micron and nanoscale imaging and analysis of materials. The center, housed in Building 22 of the North Campus Research Complex, provides state-of-the-art instruments, professional training, and in-depth education for students and other internal researchers, fellow academic institutions, and local industry. (MC)2 supports a diverse multi-disciplinary user base of more than 450 users from various colleges and departments, 100+ internal research groups, and over 20 non-academic companies. 

Instrumentation Updates

Emmanuelle Marquis, Center Director and Associate Professor of Materials Science and Engineering, together with a number of colleagues, received a grant from the National Science Foundation–Major Instrumentation (NSF-MRI) Program, which allowed (MC)2 to acquire a new scanning electron microscope for real-time studies of materials behaviors. This TESCAN RISE system is a variable pressure SEM, with in-situ Raman spectroscopy and imaging capability, a full cathodoluminescence system, an electron back-scattered diffraction system, an X-ray energy dispersive spectrometry system, and a high temperature heating stage.

Another new development is that (MC)2 is collaborating with the Michigan Ion Beam Lab (MIBL) in offering unique opportunities for in-situ irradiation experiments using the FEI Tecnai G2 F30 TWIN, a 300 kV transmission electron microscope interfaced with a particle accelerator and a low energy ion source. Two separate ion species can be mixed and delivered to the TEM stage. The microscope, which is located in MIBL, is available for use now.

In early 2018, we unveiled our new Zeiss Xradia Versa 520 instrument. X-ray micro computed tomography (micro CT) is X-ray imaging in 3D, using a similar method to that of hospital CT (or “CAT”) scan systems, but on a fine scale with significantly increased resolution. As a 3D microscopy technique, it allows the very fine-scale internal structure of objects to be imaged non-destructively.

In spring of 2019, two new instruments will be arriving: the FEI Talos F200X G2, a 200 kV FEG scanning transmission electron microscope (S/TEM), and the FEI Helios G4 PFIB UXe, a high-resolution SEM with an Xe plasma focused ion beam. 

The center is also currently in the process of upgrading the camera on the JEOL 3100R05 microscope to facilitate in-situ imaging, fast acquisition video recording, and low-dose electron energy loss spectroscopy, by installing a Gatan K2 camera.