TESCAN MIRA3 FEGSEM

Michigan Center for Materials Characterization/Techniques and Instruments/TESCAN MIRA3 FEGSEM

Applications

Materials Science and Geological Sciences

  • Surface imaging (topology, chemistry, phase contrast)
  • Orientation imaging (automated large scale, image stitching)

Contact

Nancy Senabulya Muyanja

Location

Room G022

Acknowledgments

Publications, presentations, and posters resulting from work on this instrument should state: “The authors acknowledge financial support from the University of Michigan College of Engineering and technical support from the Michigan Center for Materials Characterization.“

Specifications

  • Accelerating Voltage 0-30kV
  • Filament: Schottky Field Emitter
  • Detectors
    • Secondary Electron Imaging – Everhart-Thornley Detector (ETD)
    • Backscattered Electron Detector (WD > 8mm) 
    • EDS (WD = 15mm) – EDAX
    • EBSD (WD= 10-20mm) – EDAX Hikari Camera
  • SEM Resolution: 1.2nm
  • Imaging mode
    • Resolution Mode (WD = 5-10mm): high resolution and low depth of focus
    • Depth Mode: good resolution and increased depth of focus
    • Field Mode: large field of view, high depth of focus but worse resolution
    • Wide Field Mode (WD >25mm): extra large field of view but focus is not accurate
  • GM Chamber and Sample Stage
    • Internal Diameter: 340mm (width) x 315mm (depth)
    • Maximum Specimen Height: 145mm without rotation stage; 116 with rotation stage
    • Maximum Specimen Weight: up to 8kg
    • Movement: x,y: +/- 65mm,; z: 0 to 100mm. 100mm is where the stage is all the way down; Tilt +/- 90 degree
  • Vacuum: Sputter Ion Pump for FEG and Molecular Drag Pump for chamber and column
  • PC and Software
    • SEM PC
      • MIRA3 Control Software
    • EDAX PC
      • TEAM for EDS and EBSD
      • OIM Analysis is on EDAX PC for EBSD data analysis
  • Sample Requirements
    • Not for magnet materials, especially powder samples.
    • Samples must be compatible with high vacuum, i.e., clean and dry. Samples should be handled with tweezers or gloves.
    • Samples need to be conductive and connected to ground (that is the stage); if not, the surface should be coated with a conductive layer, such as Au or Carbon, then apply a conductive tape, Copper or Carbon tape, connected to the SEM stub. The stub should be tightened by screw.
  • Bruker Hysitron PI 89 PicoIndenter installed to provide option for nanomechanical testing with simultaneous imaging. PI 89 specifications below:
    • Standard Low Load Transducer: maximum15mN indent / 14mN tensile
    • High Load Transducer : maximum 500mN indent / 100mN tensile
    • Maximum Displacement:  150um
    • Force Noise Floor inside SEM: LL <0.4uN, HL<5uN
    • Force Noise Floor in ideal case:  LL<50nN
    • Displacement Noise Floor inside SEM: <1nm
    • Displacement Noise Floor in ideal case: <0.1nm
    • Sample Positionning Range: 12mm (Z) x 26mm(X) x 29mm(Y indentation axis)
    • Tilt-rotation stage (maximum 400mN)
    • Load or displacement-controlled testing modes enable nanoindentation, compression, tension, fatigue, creep or bending tests. 
    • In-situ heating elements to probe and sample, indentation at temperature up to 800C
    • Probes:
      • Standard Berkovich (1)
      • Flat-end (3): 1um, 5um, 20um
      • Cube corner (1)
      • Cono-spherical (1) tip radius less then 1um 
      • 800C Berkovich (1) for heating stage only
      • Diamond gripper (1) for direct-pull test on dog-bone sample

Resources

MC2_PI89Download

References

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