Hysitron TriboIndenter

Applications

Materials Science, Life Sciences, and Geological Sciences

Contact

Haiping Sun 
Location: Room G030 

Acknowledgments

Publications, presentations, and posters resulting from work on this instrument should state: “The authors acknowledge the financial support of the University of Michigan College of Engineering and technical support from the Michigan Center for Materials Characterization.”

Specifications

  • Available Testing Modes
    • Quasistatic nanoindentation
      • Measure Young’s modulus, hardness, fracture toughness and other mechanical properties via nanoindentation.
        • Duel Head Load range: from ≤30 nN to 10 N
    • 2D Scratch testing
      • Quantify scratch resistance, critical delamination forces, and friction coefficients with simultaneous normal and lateral force and displacement monitoring.
    • nanoDMA®
      • Investigate time-dependent properties of materials using a dynamic testing technique designed specifically for polymers and biomaterials.
    • Modulus Mapping™
      • Obtain quantitative maps of the storage and loss stiffness and moduli from a single SPM scan.
    • nanoECR®
      • Conductive nanoindentation system capable of providing simultaneous in-situ electrical and mechanical measurements for investigating material deformation and stress induced transformation behavior.
    • In-situ SPM Imaging with Closed-Loop Scanner
      • Scan range (100 μm × 100 μm × 15 μm
      • Positioning Resolution: +/-10 nm
      • Imaging Contact force < 70nN
    • MEMS-based xProbe
      • Provide quantitative nanomechanical measurement of thin films, soft materials, surface interaction forces and low contact force SPM imaging, with high seysensitivity at small scale.
  • Standard Transducers
    • DMA  
      • Load <10mN; Displacement <5um
      • Dynamic Force Amplitude <5mN
      • Dynamic Displacement Amplitude < 2.5um
      • Frequency: 0.1Hz to 300Hz
      • Data Acquisition Rate: <38kHz
    • ECR  
      • Load <10mN; Displacement <5um
    • 2D     
      • Quasistatic indentation: Load <10mN; Displacement <5um
      • nanoScratch test: Load <2mN; Displacement< 15um
    • Load
      • Resolution: <1 nN
      • Noise Floor: <30 nN
      • Imaging Contact force < 70nN
    • Displacement
      • Resolution: <0.02 nm
      • Noise Floor: <0.2 nm
      • Drift: <0.05 nm/sec
  • xProbe
    • Berkovich Probe: Load <1mN; Displacement <500nm
    • Cube Corner Probe: Load <1mN; Displacement <500nm
    • Imaging only Probe
    • Load Noise Floor: <2nN
    • Displacement Noise Floor: <0.020nm
    • Displacement Resolution: <0.006nm
  • High Load Transducers
    • Load < 12N; Displacement < 97um
  • Probes
    • Berkovitch standard probe for normal indentation
    • Berkovitch fluid cell probe
    • Berkovich Pulsar-Ceramic probe (ECR only)
    • Berkovitch, High Temp, xSol probe
    • HL-Berkovich Probe
    • HL-Conical Probe (50um 60°)
    • Cube corner probes for sharp indents
    • Conical probes (50um 90°)(5um 60°)(1um 90°)
  • Stage Specifications
    • X and Y stages
      • Travel: 250 mm × 150 mm
      • Positioning Resolution: 500 nm
  • Heating Stage xSol 600
    • Temperature: <600°
  • Piezoelectric Anti-Vibration System
    • Actively dampens vibrations under 200 Hz
    • Passively dampens those over 200Hz
  • Optic Specifications
    • Normal field of view
      • Max: 625 μm × 550 μm
      • Min: 28 μm × 22 μm
    • Magnification
      • Optical: 20X
      • Digital Zoom: 0.5X–11X
      • Effective: 10X–220X

References and Publications

  1. Mechanical properties of individual phases of ZrB2-ZrC eutectic composite measured by nanoindentation, Eric Jianfeng Cheng,Ying Li, Jeff Sakamoto, Shaobo Han, Haiping Sun,Jacob Noble, Hirokazu Katsui, Takashi Goto, Journal of the European Ceramic Society, 37(13), 4223-4227, 2017