Philips XL30 FEG SEM

Contact: Bobby Kerns

Live webcam

Location: Room G027 
Phone: +1 (734) 764-5623
Acknowledgments: Publications resulting from work on this instrument should acknowledge the support of the University of Michigan College of Engineering.

Note: This instrument was funded from a variety of sources including the College of Engineering and the Department of Materials Science and Engineering, but the largest portion of the funds came from an AFSOR MURI headed by Ron Gibala (DOD-G-F49620-93-1-0289, Center for Advanced Structural Metallic Materials).  


Accelerating Voltage

  • 0.5 to 3.0 kV (100 V steps)
  • 3.0 to 30 kV (1 kV steps)


  • Zirconated Tungsten


  • ~10-6 torr in sample chamber


  • Imaging: Everhart-Thornley & Solid State Backscatter Detector
  • XEDS: UTW Si-Li Solid State X-ray Detector (with integrated EDAX Phoenix XEDS system)
  • OIM: TexSEM Laboratories OIM System


  • 20 – 1,000,000x

SEM Resolution

  • 2.0 nm at 30 kV
  • 5.0 nm at 1 kV

Sample Requirements

  • Samples must be compatible with high vacuum, i.e. clean and dry. Samples should be handled with tweezers or gloves.
  • A large range of sample sizes will fit into the chamber up to a limit of about 6 inches in diameter and/or ~ 2 inches tall. You may not be able to access the entire area of a very wide sample. Ask for assistance if you are approaching the limits.
  • Samples need to be conductive. Semi-conductors are OK. Non-conductive samples should be coated with a conductive layer. Conductive samples surrounded by a non-conducting medium should be provided a conductive path to the SEM stub.