Kratos Axis Supra+

Areas

  • Nanomaterials
  • Photovoltaics
  • Catalysis
  • Corrosion
  • Adhesion
  • Biomaterials
  • Polymers
  • Magnetic media
  • Display technology
  • Surface treatments
  • Thin film coatings
  • Electronic devices and packages
  • Battery materials and storage

Applications

  • Surface chemical composition
  • Elemental state of material surface
  • Elemental spatial distribution
  • Depth-profiling
  • In-situ heating and cooling
  • In-situ electrical biasing
  • Air sensitive sample preparation
  • Valence band properties and electronic work function
  • Electronic band gap measurements / relative energy levels of unoccupied orbitals

Contact

Nancy Senabulya Muyanja

Location

Room G019

Acknowledgments

Publications, presentations, and posters resulting from work on this instrument should state: “The authors acknowledge the financial support of the University of Michigan College of Engineering and technical support from the Michigan Center for Materials Characterization.”

Specifications

  • X-ray Sources: Monochromatic Al k and Ag L source
    • High voltage: 15kV max
    • Electron current: 40mA max
  • Operating Modes
    • Spectroscopy
      • Xray Photoelectron Spectroscopy
      • Ultraviolet Photoelectron Spectroscopy
      • Auger Electron Spectroscopy
      • Reflection Electron Energy Loss Spectroscopy
    • Imaging
      • X-ray Mapping
      • Scanning Auger Mapping
      • Secondary Electron Microscopy
    • Angle Resolved X-ray Photoelectron Spectroscopy (ARXPS)
  • Vacuum System
    • Flexi-lock: <5 x 10-9 torr
    • Specimen Analysis Chamber (SAC): ~5 x 10-10 torr
  • Specimen Stage
    • Motorized sample movement in x, y, z, θ, φ
  • Analysis Area (spectroscopy/imaging)
  • More than XPS: complementary techniques available
    • Hard X-ray photoelectron spectroscopy (HAXPES) with the Ag L⍺ anode resulting in increased sampling depth ~ 20nm
    • Ultraviolet photoelectron spectroscopy (UPS) with Helium discharge lamp
    • Ion scattering spectroscopy (ISS)
    • Reflection electron energy loss spectroscopy (REELs)
    • Field emission electron source
      • Scanning Auger mapping (SAM)
      • Secondary electron microscopy (SEM) with ~ 100nm resolution
      • Auger electron spectroscopy (AES)
  • Surface to bulk measurements (depth profiling)
    • Multi-mode ion source operating in monatomic Ar+ or Arn+ cluster modes
    • Gas cluster ion source is suited to organic material depth profiling
    • Monatomic Ar+ mode: 0.5keV – 5keV ion energy
  • Surface preservation/modification
    • Heat and cool holder ( -100C to 800C)
    • In situ sample bias/ current holder
    • Glove box for air sensitive sample preparation
    • Shuttle holder for air sensitive sample transport